M1A3P600L-1FGG144,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sy...
M1A3P600L-1FG484I,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sy...
M1A3P600L-1FG484,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sys...
M1A3P600L-1FG256I,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sy...
M1A3P600L-1FG256,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sys...
M1A3P600L-1FG144I,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sy...
M1A3P600L-1FG144,现场可编程门阵列(FPGA),600K Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3L,逻辑门数量(Gates):600000,系统门数量(Sys...
M1A3P600-PQG208I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System ...
M1A3P600-PQ208I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-PQ208,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System Ga...
M1A3P600-FGG484I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System ...
M1A3P600-FGG484,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-FGG256I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System ...
M1A3P600-FGG256,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-FGG144I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System ...
M1A3P600-FGG144,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-144封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-FG484I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-FG484,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System Ga...
M1A3P600-FG256I,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System G...
M1A3P600-FG256,现场可编程门阵列(FPGA),600K Gates,231MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,FBGA-256封装,详细参数为:所属产品系列:ProASIC3,逻辑门数量(Gates):600000,系统门数量(System Ga...
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