M1A3PE3000L-FGG484
M1A3PE3000L-FGG484,现场可编程门阵列(FPGA),3M Gates,781.25MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(S...
M1A3PE3000L-FG896M
M1A3PE3000L-FG896M,现场可编程门阵列(FPGA),3M Gates,130nm (CMOS) Technology,1.2V/1.5V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(System...
M1A3PE3000L-FG896I
M1A3PE3000L-FG896I,现场可编程门阵列(FPGA),3M Gates,781.25MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(S...
M1A3PE3000L-FG896
M1A3PE3000L-FG896,现场可编程门阵列(FPGA),3M Gates,781.25MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(Sy...
M1A3PE3000L-FG484M
M1A3PE3000L-FG484M,现场可编程门阵列(FPGA),3M Gates,130nm (CMOS) Technology,1.2V/1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(System...
M1A3PE3000L-FG484I
M1A3PE3000L-FG484I,现场可编程门阵列(FPGA),3M Gates,781.25MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(S...
M1A3PE3000L-FG484
M1A3PE3000L-FG484,现场可编程门阵列(FPGA),3M Gates,781.25MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(Sy...
M1A3PE3000L-1PQG208I
M1A3PE3000L-1PQG208I,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量...
M1A3PE3000L-1PQG208
M1A3PE3000L-1PQG208,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(...
M1A3PE3000L-1PQ208I
M1A3PE3000L-1PQ208I,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(...
M1A3PE3000L-1PQ208
M1A3PE3000L-1PQ208,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,PQFP-208封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(S...
M1A3PE3000L-1FGG896M
M1A3PE3000L-1FGG896M,现场可编程门阵列(FPGA),3M Gates,130nm (CMOS) Technology,1.2V/1.5V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(Syst...
M1A3PE3000L-1FGG896I
M1A3PE3000L-1FGG896I,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量...
M1A3PE3000L-1FGG896
M1A3PE3000L-1FGG896,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(...
M1A3PE3000L-1FGG484M
M1A3PE3000L-1FGG484M,现场可编程门阵列(FPGA),3M Gates,130nm (CMOS) Technology,1.2V/1.5V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(Syst...
M1A3PE3000L-1FGG484I
M1A3PE3000L-1FGG484I,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量...
M1A3PE3000L-1FGG484
M1A3PE3000L-1FGG484,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-484封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(...
M1A3PE3000L-1FG896M
M1A3PE3000L-1FG896M,现场可编程门阵列(FPGA),3M Gates,130nm (CMOS) Technology,1.2V/1.5V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(Syste...
M1A3PE3000L-1FG896I
M1A3PE3000L-1FG896I,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(...
M1A3PE3000L-1FG896
M1A3PE3000L-1FG896,现场可编程门阵列(FPGA),3M Gates,892.86MHz,130nm (CMOS) Technology,1.2V,由Microsemi原厂生产,FBGA-896封装,详细参数为:所属产品系列:ProASIC3EL,逻辑门数量(Gates):3000000,系统门数量(S...