HMC559
HMC559,射频运放芯片,RF Amp Chip Single Power Amplifier 20000MHz 10.5V,品牌:ADI(Analog Devices),封装:3DIE,咨询购买请致电:0755-83897562
- Description：RF Amp Chip Single Power Amplifier 20000MHz 10.5V 6-Pin DIE Waffle
- 品牌：ADI(Analog Devices)
- 封装：3DIE
- 描述：射频运放芯片,RF Amp Chip Single Power Amplifier 20000MHz 10.5V
- DataSheet：数据手册 pdf
电气特性 Features
| Number of Channels per Chip: | 1 |
| Type: | Power Amplifier |
| Typical Output Power: | 27@20000MHz dBm |
| Typical Power Gain: | 14@20000MHz dB |
| Maximum Operating Frequency Range: | 0 to 20000 MHz |
| Maximum Output Return Loss: | 8(Typ)@20000MHz dB |
| Typical Noise Figure: | 4.5@20000MHz dB |
| Typical Output Intercept Point: | 33@20000MHz dBm |
| Typical Single Supply Voltage: | 10 V |
| Maximum Power Dissipation: | 5000 mW |
| Maximum Supply Current: | 400@10V mA |
| Rad Hard: | No |
- Description：RF Amp Chip Single Power Amplifier 20000MHz 10.5V 6-Pin DIE Waffle
- 品牌：ADI(Analog Devices)
- 封装：3DIE
- 描述：射频运放芯片,RF Amp Chip Single Power Amplifier 20000MHz 10.5V
- DataSheet：数据手册 pdf
