A3P030-1QNG68I
A3P030-1QNG68I,现场可编程门阵列(FPGA),30K Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,QFN-68 EP封装,详细参数为:工作温度:-40 to 85 ℃,增强抗辐射性:No,库存实时更新.咨询购买请致电:0755-83897562
A3P030-1QNG68I,现场可编程门阵列(FPGA),30K Gates,272MHz,130nm (CMOS) Technology,1.5V,由Microsemi原厂生产,QFN-68 EP封装,详细参数为:工作温度:-40 to 85 ℃,增强抗辐射性:No,库存实时更新.咨询购买请致电:0755-83897562